Powertech Technology Inc.

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products worldwide. The company provides IC backend services, which include IC chip probing, packaging, final testing, and burn in to end products. It also offers Quad Flat No Lead package services for electrical interconnection in handheld devices, such as cellular phones, PDAs, MP3s, game consoles, and other portable products; redistribution layer services for au or cu wire bonding; copper pillar and lead-free bumping services; chip scale package and chip on wafer for packaging CMOS image sensors; FBGA (BOC) packages; and FBGA packages for smart phones, tablets, and SSD products. In addition, the company provides thin smaller outline packages for various devices, including ROM, NOR, NAND Flash, SDRAM, and DDR; packaging and testing services for the memory card-micro SD cards; multi-chip packages for various handheld or data storage devices, such as cellular phones, PDAs, mobile game platforms, digital consumer devices, removable memory cards, USB drives, etc.; and system-in-packages for graphics processor, CPU, digital mobile TV, GPS, Wi-Fi, Wimax, Bluetooth, baseband, air bag detector, tire pressure gauge, keyless products, etc. Further, it offers package-on-package/package-in-package services for space savings, enhanced wafer thinning technology, control on warpage, and eliminated die cracks; FCBGA packages for chipsets and microprocessors; and FCCSP packages for graphic memory products and cellular phones. Additionally, the company is involved in the semiconductor testing and assembly; and the investment businesses, as well as provides wafer probing test services. Powertech Technology Inc. was founded in 1997 and is headquartered in Hsinchu, Taiwan.